High-performance 3-D microbattery suitable for large-scale on-chip integration

By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices.

"This 3D microbattery has exceptional performance and scalability, and we think it will be of importance for many applications," explained Paul Braun, a professor of materials science and engineering at Illinois. "Micro-scale devices typically utilize power supplied off-chip because of difficulties in miniaturizing energy storage technologies. A miniaturized high-energy and high-power on-chip battery would be highly desirable for applications including autonomous microscale actuators, distributed wireless sensors and transmitters, monitors, and portable and implantable medical devices."

Read more at: phys.org/news/
Image Credit: University of Illinois